- Plating Finish : leaded or lead-free HASL (Hot Air Solder Leveling) vs ENIG (Electroless nickel immersion gold) plating. HASL pad는ENIG보다 평탄하지 않다.
- Copper trace: 6 mil
- Hole size: 0.2 – 0.3mm via 사이즈가 일반적
- Silk: LPI printing (Liquid photo imaging)이 높은 해상도를 가짐
- Castellated Holes
- FreeDFM: https://www.my4pcb.com/net35/FreeDFMNet/FreeDFMHome.aspx
