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Posts tagged with: Package

칩 용어: BSC

칩의 패키지 dimension 정보에 나오는 BSC란?

BSC (Basic Spacing between Centers) is a term that appears on IC package drawings in reference to dimensions between pins.

“Basic” spacing is nominal and can change with conditions. For example, the distance between the rows of pins on a DIP (dual inline package) is BSC because it changes when the auto insertion machine grabs the part, and again when the part is inserted. The BSC dimension, in this case, is the dimension of the hole spacing that the part will fit into, rather than the dimensions of the part itself.

출처: http://www.maxim-ic.com/glossary/definitions.mvp/term/Basic-Spacing-between-Centers/gpk/1119

위 그림의 내용은 첨부의 Package FAQ에 나오는 내용