PCB 제조 관련

  • Plating Finish : leaded or lead-free HASL (Hot Air Solder Leveling) vs ENIG (Electroless nickel immersion gold) plating. HASL pad는ENIG보다 평탄하지 않다.
  • Copper trace: 6 mil
  • Hole size: 0.2 – 0.3mm via 사이즈가 일반적
  • Silk: LPI printing (Liquid photo imaging)이 높은 해상도를 가짐
  • Castellated Holes
  • FreeDFM: https://www.my4pcb.com/net35/FreeDFMNet/FreeDFMHome.aspx

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